Field emitter array integrated circuit chip interconnection

Details Field emitter array integrated circuit chip interconnection Field emitter array integrated circuit chip interconnection

1990-05-22

1991-09-10

Jackson, Jr., Jerome

357 79, 357 75, H01L 2348, H01L 2944, H01L 2952

Patent

active

050478303

ABSTRACT:
A separable assembly for connecting and mounting an integrated circuit chip (10) to a chip carrier substrate (12) utilizing the principle of field emitter current induction. Transmitting zones (14, 26, 28) on the chip (10) and substrate (12) are formed as recessed arrays of field emitter projections (30, 32) and the respective receiving zones (24, 16, 18) are planar conductive films. The chip (10) and the substrate (12) are separably connected with the respective transmitting and receiving zones in alignment with each other.

REFERENCES:
patent: 3423638 (1969-01-01), Dix et al.
patent: 4215359 (1980-07-01), Schermer et al.
patent: 4513308 (1985-04-01), Greene et al.
patent: 4748483 (1988-05-01), Dahlberg
patent: 4857161 (1989-08-01), Borel et al.
"Electronic Engineering Times", Vacuum Semi R & D Picks Up, pp. 35, 38, Jan. 29, 1990.

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