Method of manufacturing ball grid array electronic component

Details Method of manufacturing ball grid array electronic component Method of manufacturing ball grid array electronic component

1999-02-12

2000-07-11

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

458118, 458455, H01L 23495

Patent

active

060872012

ABSTRACT:
A method of manufacturing an electronic component with an insulating coating that is electrically conductive when heated adhered to a bottom surface of a semiconductor device with an external wiring ball grid array so that a top portion of the ball grid array is exposed, the method including locating the ball grid array on a wiring conductor on a circuit substrate and anodically bonding the insulating coating to the wiring conductor so that the ball grid array and the wiring conductor are electrically connected to each other.

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