Surface-protecting film and resin-sealed semiconductor device ha

Details Surface-protecting film and resin-sealed semiconductor device ha Surface-protecting film and resin-sealed semiconductor device ha

1995-08-22

2000-07-11

Hampton-Hightower, P.

Stock material or miscellaneous articles

Composite

4284735, 428901, 528353, 26427217, 174 525, 257643, 257666, 257676, B32B 900, H01L 2300, B29C 1300

Patent

active

060870060

ABSTRACT:
A surface-protecting film is formed on the surface of the semiconductor element of a resin-sealed semiconductor device to prevent the peeling and cracking of the sealing member used in said device, by coating on said surface a polyimide precursor composition containing a polyimide precursor having a recurring unit constitution represented by the following general formula (1) and heat-curing the coated polyimide precursor composition: ##STR1## wherein R.sup.1 is a trivalent or tetravalent aromatic group; R.sup.2 and R.sup.3 are each a tetravalent organic group having 4 or more carbon atoms; R.sup.4 is a bivalent organic group having 4 or more carbon atoms; X is a bivalent organic group containing at least one member selected from the group consisting of oxygen and nitrogen: Y is a monovalent organic group having 15 or less carbon atoms; n=5-100 and m=0-95 with a proviso that n+m=100; and p is 1 or 2).

REFERENCES:
patent: 5310862 (1994-05-01), Nomura et al.
patent: 5314842 (1994-05-01), Sawaya et al.
patent: 5348835 (1994-09-01), Oha et al.
patent: 5397682 (1995-03-01), Matsuoka et al.
patent: 5601905 (1997-02-01), Watanabe et al.
patent: 5793099 (1998-08-01), Murakami et al.

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