Solder plate assembly and method

Details Solder plate assembly and method Solder plate assembly and method

Filed on

1990-06-25

Date issued

1991-09-10

Examiner

Abrams, Neil

Patent Class

Electrical connectors

SubClass

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

SubSubClass

Distinct contact secured to panel circuit

Other Related Categories

439876, 2281801, H01R 402

Type

Patent

Status

active

Patent number

050469576

Description

ABSTRACT:
A method and structure includes a solder plate assembly (20) includes a high temperature plastic having apertures (22) arranged in a grid to receive contact pins (14) of a connector (12) inserted therethrough with solder rings (28) cast into the said apertures and adapted to be reflowed to join pins to circuit board circuits contained in board apertures (34) therein.

REFERENCES:
patent: 3591922 (1968-12-01), Pardee et al.
patent: 3864014 (1975-02-01), Lynch
patent: 3932934 (1976-01-01), Lynch et al.
patent: 4206542 (1980-06-01), Reavill
patent: 4216350 (1980-08-01), Reid
patent: 4641426 (1987-02-01), Hartman et al.
patent: 4663815 (1987-05-01), Hartman et al.
patent: 4774760 (1988-10-01), Seaman et al.
patent: 4842184 (1989-06-01), Miller, Jr.
patent: 4872846 (1989-10-01), Clark
Ray Doutrich, "DuFlo" Header System, DuPont, pp. 2`4 (Sep. 26, 1986).
"New Duflow Headers", Dupont Connector Systems (1987).
"Vapor-Phase Quickie Headers", Dupont Connector Systems (1986), pp. 2-7.

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