Ultrasonic wire bonding apparatus

Details Ultrasonic wire bonding apparatus Ultrasonic wire bonding apparatus

1989-10-25

1991-09-10

Ramsey, Kenneth J.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228102, H01L 21607

Patent

active

050466542

ABSTRACT:
An ultrasonic wire bonding apparatus including a ultrasonic oscillation control circuit which causes a transducer having a bonding tool fastened at one end to be vibrated by ultrasonic oscillation voltage. The control circuit includes an electric current amplifier connected to the transducer, an A/D converter to which an electric current amplified by an electric current amplifier is supplied so as to be converted into digital signal which is supplied to a microcomputer, an ultrasonic oscillating circuit, and an output control circuit to which ultrasonic oscillation voltage is supplied from the ultrasonic oscillating circuit. The output control circuit controls the ultrasonic oscillating voltage by comparing it to the ultrasonic oscillating output data supplied from the computer and supplies the thus controlled voltage to the transducer through a power amplifier so as to vibrate the transducer.

REFERENCES:
patent: 4525790 (1985-06-01), Nakamura
patent: 4808948 (1989-02-01), Patel et al.

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