Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1992-02-27
1993-04-06
Silverberg, Sam
Chemistry: electrical and wave energy
Apparatus
Electrolytic
C23F 1300
Patent
active
052000478
ABSTRACT:
The concentration of a plating solution in which a workpiece is plated is automatically controlled within a permissible range by replenishing a consumable ingredient to the plating solution in an amount corresponding to the amount of consumption estimated from the surface area of the workpiece for a given plating solution composition under given plating conditions. By measuring the concentration of the consumable ingredient in the plating solution, the replenishment of consumable ingredient is interrupted for a predetermined time or the amount of the consumable ingredient replenished is reduced when the measured concentration is above the permissible range, or the amount of consumable ingredient replenished is increased or a necessary amount of the consumable ingredient is additionally supplied to the plating solution separately from the normal replenishment of consumable ingredient when the measured concentration is below the permissible range.
REFERENCES:
patent: 4286965 (1981-09-01), Vanhumbeech et al.
patent: 4331699 (1982-05-01), Suzuki et al.
patent: 4406249 (1983-09-01), Araki et al.
patent: 4406250 (1983-09-01), Araki et al.
patent: 4479980 (1984-10-01), Acosta et al.
patent: 4556845 (1985-12-01), Strope et al.
patent: 4623554 (1986-11-01), Kaschak et al.
Hashimoto Shigeo
Sugiura Yutaka
C. Uyemura & Co., Ltd.
Silverberg Sam
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