Semiconductor device manufacturing apparatus

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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156626, 156627, 118723, 20429803, 20429832, 20429834, 20429806, H01L 2100

Patent

active

052000168

ABSTRACT:
In a semiconductor device manufacturing apparatus for performing an etching operation with a reaction gas, in which three electrodes, namely, upper, intermediate and lower electrodes, are arranged parallel to one another, and the intermediate electrode is in the form of a grid, having a number of through-holes, the axis of at least one of the through-holes in the intermediate electrode is inclined with respect to the central axis of the intermediate electrode. Accordingly, etching energy is uniformly applied to the entire surface of a material to be etched, thereby to achieve etching uniformly both in speed and in configuration.

REFERENCES:
patent: 4661203 (1987-04-01), Smith et al.

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