Method of manufacturing a coin detector

Metal working – Method of mechanical manufacture – Electrical device making

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194319, H01F 4102

Patent

active

055750575

ABSTRACT:
Coin detector may be manufactured in several steps. An integrated circuit board (ICB) having conductive material on its surface is covered with an etching mask where conductive elements are to be located. The unmasked portion of the ICB surface is etched off, and then the etching mask is removed. The ICB substrate is attached with a detector circuit located on an etched portion of the ICB surface. An oscillator circuit is connected to a conductive coil. If the coin detector uses a two-layer coil, the coils are connected by a through-going board. The structure is encased in a synthetic material.

REFERENCES:
patent: 3185947 (1965-05-01), Freymodsson
patent: 4035695 (1977-07-01), Knutson et al.
patent: 4441602 (1984-04-01), Ostroski et al.
patent: 5067229 (1991-11-01), Nakamura
patent: 5133118 (1992-07-01), Lindblad et al.

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