Method and apparatus for measuring the vibration amplitude on an

Details Method and apparatus for measuring the vibration amplitude on an Method and apparatus for measuring the vibration amplitude on an

1992-01-22

1993-04-06

Seidel, Richard K.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228103, 228110, 228 11, B23K 106, B23K 2010, B23K 3112

Patent

active

051996308

ABSTRACT:
A method, and apparatus for performing the method, for the ultrasonic contacting wired connection of electrical circuits to metallic leadframe strips, which apparatus essentially includes a bonding head with the energy transducer located thereon for feeding to the process point of the leadframe strip and for producing a longitudinal vibration amplitude is supplied with a first voltage, the bonding head is associated a measuring head fixed to a machine base, and the measuring head has an optical/electrical sensor which measures the instantaneous amplitude of the longitudinal vibration of the infeed of the bonding head and determining a correction factor mathematically from the measured quantities obtained, and the first ultrasonic value for the vibration amplitude of the energy transducer is calibrated with the correction factor.

REFERENCES:
patent: 4854494 (1989-08-01), Von Rabin

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