Printed circuit board plating process

Details Printed circuit board plating process Printed circuit board plating process

1975-11-24

1977-05-24

Duzan, James R.

Metal working

Method of mechanical manufacture

Electrical device making

156656, 156659, 204 32R, 427 96, 427 98, B41M 308

Patent

active

040246310

ABSTRACT:
A process for manufacturing printed circuit boards wherein a layer of Nickel is plated atop a layer of copper in a pattern corresponding to a desired circuit configuration. The Nickel is used as an etch resist to remove copper from the board in the non-conductive areas. Subsequently, the Nickel is chemically activated such that it will accept a coating of solder particularly at the connection points and in the through-holes.

REFERENCES:
patent: 3579376 (1971-05-01), Vincent
patent: 3666549 (1972-05-01), Rhodenizer et al.
patent: 3742597 (1973-07-01), Davis
patent: 3854973 (1974-12-01), Mersereau et al.
Coombs, Printed Circuits Handbook, McGraw-Hill, 1967, pp. 5-38, 39, 40, 41, 42, 43, 44.

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