Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1990-03-20
1991-01-15
Pirlot, David L.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 70, 439525, H05K 100
Patent
active
049849913
ABSTRACT:
An IC socket has a socket board having a plurality of contacts for contacting IC leads, and IC accommodating portion formed in a central portion thereof, and an IC supporting platform adapted to support an IC package thereon and disposed in the accommodating portion so as to be movable in an upward and downward direction. The contacts are formed in parallel along opposing sides of the supporting platform. A plurality of grooves for positioning the contacts are formed in parallel in opposing sides of the IC supporting platform. Contacting portions of resilient contacting pieces of the contacts are received in the positioning grooves. The resilient contacting pieces are regulated by partition walls defining the positioning grooves. The IC socket is characterized in that among the partition wall groups formed on four sides, one portion of partition wall groups of at least two opposite sides are interconnected at free ends of the partition walls. The connecting portions function as pressing portions for moving the IC supporting platform downward and the other partition walls are left in a non-interconnected state.
REFERENCES:
patent: 4498047 (1985-02-01), Hexamer et al.
patent: 4832610 (1989-05-01), Matsuoka
patent: 4846703 (1989-07-01), Matsuoka et al.
patent: 4865554 (1989-09-01), Matsuoka et al.
patent: 4887969 (1989-12-01), Abe
Daulton Julie R.
Pirlot David L.
Yamaichi Electric Mfg. Co. Ltd.
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