Plated-through-hole method

Details Plated-through-hole method Plated-through-hole method

1982-05-28

1984-10-02

Lawrence, Evan K.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

204298, C23C 1500

Patent

active

044746598

ABSTRACT:
An apparatus and method for depositing a thin layer of material such as metal within the hole of an object such as a printed circuit board. The apparatus includes a gas diffusion chamber having a plurality of power electrodes with apertures positioned transversely therein. The objects to be treated, such as printed circuit boards, are positioned in the areas between the power electrodes. A supply of electrical energy is connected to the power electrodes and to the conductive layers of the printed circuit boards. The method of the invention comprises introducing desired gases into the chamber to flow transversely through the apertures in the power electrodes and the holes in the printed circuit boards such that the gases are excited to a plasma state to sputter a portion of the material constituting the power electrodes into the holes of the printed circuit boards.

REFERENCES:
patent: 4351697 (1982-09-01), Shanefield et al.
patent: 4425210 (1984-01-01), Fazlin
Cairns, M., Sputtering: A Surface Treatment for Economy and Fine Finish, Design Engineering, Nov. 1970, pp. 83-85.

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