Electronic assembly having improved resistance to delamination

Details Electronic assembly having improved resistance to delamination Electronic assembly having improved resistance to delamination

1998-08-13

2000-02-22

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 174 163, H05K 720

Patent

active

060287721

ABSTRACT:
An electronic assembly having a first component, a second component, and a layer of adhesive bonding the first and second components together, one or both of the first and second components includes thinned or tapered peripheral edges. The layer of adhesive includes a thickened portion which is adjacent to the thinned or tapered peripheral edges, the thickened portion having a thickness which is greater than the thickness of the remaining portion of the layer.

REFERENCES:
patent: 4920574 (1990-04-01), Yamamoto et al.
patent: 5019943 (1991-05-01), Fassbender et al.
patent: 5745344 (1998-04-01), Baslta et al.
E. Suhir, Stresses in Bi-Metal Thermostats, Sep. 1986, Journal of Applied Mechanics, vol. 108.

Affiliated with

Also associated with

Rating

Electronic assembly having improved resistance to delamination does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic assembly having improved resistance to delamination, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic assembly having improved resistance to delamination will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-525700