Patent
1988-09-09
1990-05-29
James, Andrew J.
357 70, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
049300008
ABSTRACT:
A terminal assembly for an integrated semiconductor circuit includes a semiconductor chip in the semiconductor circuit having a surface, end faces, an electrically active chip surface regions of the surface adjacent the end faces, electric circuits of the semiconductor chip within the electrically active chip surface defining at least one given area of the surface within the electrically active chip surface being free of electric circuits, contact pads disposed in the regions of the surface adjacent the end faces for electrically connecting the semiconductor circuit to electrical signals and/or potentials, and other contact pads disposed in the at least one given area between the regions of the surface adjacent the end faces for electrical connection to at least some of the electrical signals and/or potentials.
REFERENCES:
patent: 3368114 (1968-02-01), Campbell et al.
IEEE International Solid-State Circuits Conference 1985, pp. 256 to 257.
IEEE International Solid-State Circuits Conference 1985, pp. 260 to 261.
IEEE International Solid-State Circuits Conference 1985, pp. 244 to 245.
IEEE International Solid-State Circuits Conference, Feb. 10, 1982, pp. 68 to 69.
IEEE International Electron Devices Meeting, Dec. 9, 1981, pp. 62 to 65.
Patents Abstracts of Japan, vol. 7, No. 229, Oct. 12, 1983.
Crane Sara W.
Greenberg Laurence A.
James Andrew J.
Lerner Herbert L.
Siemens Aktiengesellschaft
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