Non-volatile semiconductor memory device and method of the manuf

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357 49, 357 54, 357 55, 357 59, 357 71, H01L 2978, H01L 2934, H01L 2906, H01L 2348

Patent

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049299883

ABSTRACT:
A groove is formed in a P well region to extend in a predetermined direction, and the groove is selectively filled with silicon dioxide layers so that the groove is separated into a plurality of groove portions. On each of opposed side walls of the groove portion along the direction of extension of the groove sequentially formed are a first gate insulating layer and a polysilicon layer serving as a floating gate electrode. Further, a second gate insulating layer and a polysilicon layer serving as a control gate electrode are sequentially formed on the polysilicon layer. N-type diffusion regions serving as source regions of MOS transistors are formed in the surface of the P well region, and further an N-type diffusion region serving as drain regions of the MOS transistors is formed in a surface region of the P well region that is located at the bottom of the groove portion.

REFERENCES:
patent: 4698900 (1987-10-01), Esquivel
patent: 4786953 (1988-11-01), Morie et al.

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