Alignment and exposure method

Details Alignment and exposure method Alignment and exposure method

1993-11-04

1994-07-19

Hayes, Monroe H.

Photocopying

Projection printing and copying cameras

Step and repeat

355 74, 355 77, G03B 2742, G03B 2732

Patent

active

053313712

ABSTRACT:
A semiconductor device manufacturing exposure method for exposing different portions of a semiconductor wafer with radiation in a step-and-repeat manner includes the steps of: placing the wafer on a wafer chuck; detecting a first mark of the wafer, whereby a wafer mark signal is produced; controlling a rotational position of the wafer chuck on the basis of the wafer mark signal; printing an image of a second mark of a mask on a portion of a photosensitive material layer provided on a portion of the wafer chuck outside the wafer; photoelectrically detecting the image of the second mark of the mask printed on the photosensitive layer, whereby a mask mark signal is produced; producing data necessary for control of movement of the wafer chuck through a stage, by using the mask mark signal; effecting step-and-repeat exposure of the different portions of the wafer by using a radiation beam while controlling the movement of the wafer chuck through the stage on the basis of the produced data; and blocking a portion of the radiation beam with use of a blocking member disposed between a source of the radiation beam and the wafer to prevent exposure of the photosensitive material layer during the step-and-repeat exposure.

REFERENCES:
patent: 4474463 (1984-10-01), Heimer
patent: 4702592 (1987-10-01), Geiger et al.
patent: 4758863 (1988-07-01), Nikkel
patent: 4780615 (1988-10-01), Suzuki
patent: 4798450 (1989-01-01), Suzuki
patent: 4811059 (1989-03-01), Hamasaki et al.
patent: 4853745 (1989-08-01), Kamiya et al.
patent: 4875076 (1989-10-01), Torigoe et al.
patent: 4883359 (1989-11-01), Ina et al.
patent: 4958082 (1990-09-01), Makinouchi et al.
patent: 5003342 (1991-01-01), Nishi

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