Method for making multi-layer and pin grid arrays

Details Method for making multi-layer and pin grid arrays Method for making multi-layer and pin grid arrays

1988-01-22

1989-06-20

Lindsay, Robert L.

Glass manufacturing

Processes

With shaping of particulate material and subsequent fusing...

65 42, 65 695, 65 6, 156629, 156644, 156663, C03B 1909

Patent

active

048406546

ABSTRACT:
The process of constructing a multi-layer glass-ceramic circuit is disclosed. One or more glass-ceramic substrates is formed from a slurry or molten glass particles and ceramic which was formed at a temperature wherein the glass particles are molten and the ceramic particles are solid. After an electrical conductor pattern is applied on at least a surface of one of the glass-ceramic structures, at least two glass-ceramic structures are stacked on one another with the electrical conductor pattern therebetween and heated until the glass of each glass-ceramic structure bonds with adjacent glass so as to form the multi-layer structure.

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"Packaging" by Jerry Lyman, in Electronics, vol. 54, No. 26, Dec., 1981, pp. 66-75.

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