Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Patent
1997-01-21
2000-02-22
Mulpuri, Savitri
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
438106, 445 23, H01L 2160
Patent
active
060279524
ABSTRACT:
In a method of manufacturing a string of electrically connected light emitting diodes, there is provided a number of base members, each being made of an insulator material and including a base plate formed with a pair of first terminal holes, and a spaced pair of side walls that extend upwardly from the base plate and that confine a space therebetween. A work table is formed with a number of spaced recesses for receiving the base members therein. Each recess has a bottom formed with a pair of second terminal holes that are aligned with the first terminal holes in the respective base member. Each diode has a pair of terminals that are partially extended into the aligned first and second terminal holes in the respective base member and the respective recess. Each of a pair of electrical conductors has an insulating sheath around a conductive core, and extends through the spaces in the base members so as to be disposed between one of the terminals of the diodes and one of the side walls of the base members. The diodes are pushed toward the base members such that movement of the terminals further into the second terminal holes results in a cutting action of the terminals into the insulating sheaths to establish electrical contact between the terminals and the conductive cores of the electrical conductors.
REFERENCES:
patent: 5485479 (1996-01-01), Kitamura et al.
patent: 5516727 (1996-05-01), Broom
patent: 5825051 (1998-10-01), Bauer et al.
patent: 5825054 (1998-10-01), Lee et al.
patent: 5828172 (1998-10-01), Berthold et al.
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