Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-10-29
2000-02-22
Crispino, Richard
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156257, 156268, 156269, 156292, 40310, 40630, 283 81, 283901, 283103, B32B 3100
Patent
active
060275987
ABSTRACT:
An expanded content label (ECL) having a segmented base label that allows the label to conform to a curved surface. A booklet and covering overlaminate are secured to the spaced-apart segments of the base to interconnect the segments. The gap between the segments enhances the ability of the label to flex and move along a supporting curved surface to conform to the surface without buckling or wrinkling. The label is produced by die cutting a web to form a segmented base label, securing a booklet to the segmented base label, and optionally securing an overlaminate to the booklet. At least one of the booklet and the overlaminate bridge the segments of the base label. In an alternative embodiment, the overlaminate is eliminated and the booklet includes a coversheet that extends across the gap between the base label segments.
REFERENCES:
patent: 1974401 (1934-09-01), Miller
patent: 4534582 (1985-08-01), Howard
patent: 4592572 (1986-06-01), Instance
patent: 4621442 (1986-11-01), Mack
patent: 4711686 (1987-12-01), Instance
patent: 4744161 (1988-05-01), Instance
patent: 4744591 (1988-05-01), Instance
patent: 4868027 (1989-09-01), Hunkeler et al.
patent: 5403636 (1995-04-01), Crum
patent: 5588239 (1996-12-01), Anderson
CCL Label Inc.
Crispino Richard
Gray Linda L.
LandOfFree
Method for producing an expanded content label does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for producing an expanded content label, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing an expanded content label will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-517360