Method for minimizing warp and die stress in the production of a

Details Method for minimizing warp and die stress in the production of a Method for minimizing warp and die stress in the production of a

1998-06-16

2000-02-22

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

26427217, 29831, 2281791, H05K 1300

Patent

active

060275901

ABSTRACT:
A method of minimizing warp and die stress in the production of an electronic assembly includes connecting one surface of a die to a package, and connecting an opposite surface of the die to a lid disposed over a constraining ring that is mounted to the package. The lid has a size, shape and coefficient of thermal expansion (CTE) selected to generate a bending moment that opposes bending moments resulting from connecting the die to the package.

REFERENCES:
patent: 2960641 (1960-11-01), Cohen et al.
patent: 3374536 (1968-03-01), Schoeder et al.
patent: 3469148 (1969-09-01), Lund
patent: 3585272 (1971-06-01), Shetz
patent: 3953566 (1976-04-01), Gore
patent: 4482516 (1984-11-01), Bowman et al.
patent: 4704626 (1987-11-01), Muhulikar et al.
patent: 4705762 (1987-11-01), Ota et al.
patent: 4897508 (1990-01-01), Mahulikar et al.
patent: 4985296 (1991-01-01), Mortimer, Jr.
patent: 5386339 (1995-01-01), Polinski, Sr.
patent: 5528457 (1996-06-01), Hawke et al.
patent: 5545473 (1996-08-01), Ameene et al.
"Semiconductor Device Package Having a Substrate with a Coefficient of Expansion Matching Silicon" IBM Technical Disclosure, vol. 20, No. 7, Dec. 1977, pp. 2849-2850.
"Semiconductor Encapsulation," IBM Technical Disclosure Bulletin, vol. 20, No. 10, Mar. 1978, pp. 3903-3905.

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