Manufacturing method of semiconductor device comprising molded r

Details Manufacturing method of semiconductor device comprising molded r Manufacturing method of semiconductor device comprising molded r

1996-03-05

1998-03-31

Picardat, Kevin

Fishing, trapping, and vermin destroying

437205, 437214, 437217, 437219, 437220, H01L 2160

Patent

active

057337993

ABSTRACT:
This invention provides a method for manufacturing a semiconductor device having molded resin encapsulating a semiconductor chip and external leads extending from this molded resin to the outside, wherein excess resin projecting from edge portions of the molded resin is removed after a resin encapsulating step and a wax film is reformed on break surfaces and cracked parts of the molded resin produced in the excess resin removing step by heating the molded resin to a predetermined temperature after removing tie-bars from the external leads, whereby abnormal growth of solder between the external leads in a subsequent solder plating process is prevented and failures caused by short-circuiting between terminals are thereby prevented.

REFERENCES:
patent: 4920074 (1990-04-01), Shimizu et al.
patent: 5347709 (1994-09-01), Maejima et al.
patent: 5474958 (1995-12-01), Djennas et al.

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