Metal working – Method of mechanical manufacture – Electrical device making
Patent
1989-09-07
1990-05-29
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
174263, 2281801, H05K 334
Patent
active
049283871
ABSTRACT:
Printed wiring boards using surface mount and other components are manufactured using a double-sided tape assembly. The tape assembly is composed of a soluble base layer coated on each side with an adhesive layer, and these layers are sandwiched between top and bottom protective release paper layers. Holes are formed in the tape assembly corresponding to the location of solder pads on the printed wiring board, and the tape assembly is adhered to the printed wiring board after removal of the bottom adhesive layer. Solder paste is applied to the top release layer, filling the holes in the tape assembly. The top release layer is removed, exposing the top adhesive layer, and the component is pressed onto the adhesive layer with its terminations in registry with the solder-filled holes. The board assembly is then soldered, and the remaining base and adhesive layers of the tape assembly are removed by action of a solvent during cleaning.
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Product Brochure, "YR-5414 Water Soluble Wave Solder Tape," 3M.
Mather John C.
Young Jerald A.
Arbes Carl J.
Hamann H. Fredrick
Murrah M. Lee
Rockwell International Corp.
Sewell V. Lawrence
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