Polishing pads used to chemical-mechanical polish a semiconducto

Details Polishing pads used to chemical-mechanical polish a semiconducto Polishing pads used to chemical-mechanical polish a semiconducto

1993-04-30

1994-07-19

Rose, Robert A.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51209DL, 51DIG34, B24B 722

Patent

active

053297342

ABSTRACT:
The present invention includes a polishing pad to improve polishing uniformity across a substrate and a method using the polishing pad. The polishing pad has a first region that lies closer to the edge of the polishing pad and a second region that lies further from the edge of the polishing pad. The second region has a plurality of openings or a larger average pore size compared to the first region. Each opening or the average pore size of the second region may be 1) between about 250-1000 microns or 2) in a range of about 25-1000 percent larger than the average pore size of the first region. The polishing pad may be used in a chemical-mechanical polishing without having to substantially changing the polisher or the operational parameters of the polisher other than the oscillating range.

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