Measuring and testing – Vibration – By mechanical waves
Patent
1997-10-03
2000-02-22
Williams, Hezron
Measuring and testing
Vibration
By mechanical waves
73627, 374119, G01N 2910, G01N 2908
Patent
active
060266880
ABSTRACT:
There is provided a monitor and method for monitoring the condition of a photoresist film on a wafer during baking in which the phase of high frequency ultrasonic pulses reflected from the wafer/photoresist interface provides an indication of the condition of the photoresist film.
REFERENCES:
patent: 4625556 (1986-12-01), Sukahara et al.
patent: 4647172 (1987-03-01), Batchelder et al.
patent: 4977330 (1990-12-01), Batchelder et al.
patent: 5052227 (1991-10-01), Le Floc'H et al.
patent: 5240552 (1993-08-01), Yu et al.
patent: 5271274 (1993-12-01), Khuri-Yakub et al.
patent: 5438872 (1995-08-01), Kobayashi et al.
patent: 5469742 (1995-11-01), Lee et al.
patent: 5661241 (1997-08-01), Harth, III et al.
patent: 5672830 (1997-09-01), Rogers et al.
Ballantine, David S., Jr. et al.; "Use of Saw Devices to Monitor Visco-Elastic Properties of Materials", IEEE 1988, pp. 559-562.
Ballantine, D.S. Jr., et al.; "Acoustic Wave Sensors: Theory, Design, and Physico-Chemical Applications", Academic Press, Chapter 4, pp. 154-167.
Degertekin F. Levent
Khuri-Yakub Buhrus T.
Morton Susan
Miller Rose M.
The Board of Trustees of the Leland Stanford Junior University
Williams Hezron
LandOfFree
Ultrasonic photoresist process monitor and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ultrasonic photoresist process monitor and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultrasonic photoresist process monitor and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-512072