Vertical connector based packaging solution for integrated circu

Details Vertical connector based packaging solution for integrated circu Vertical connector based packaging solution for integrated circu

1998-01-05

1999-12-21

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361735, 361803, H05K 116, H05K 118, H01L 2312, H01L 23488

Patent

active

060057769

ABSTRACT:
An assembly featuring a substrate and a plurality of components. The plurality of components are packaged to be connected in a vertical orientation to the substrate. These components include (i) a vertical chip-scale package (CSP), (ii) an integrated circuit die and (iii) an interconnect. Including a plurality of connection leads, the vertical CSP contains the die which is generally situated along a vertical plane. The interconnect, capable of transferring information between the plurality of connection leads and the integrated circuit die, includes a first segment generally perpendicular to the vertical plane and connected to at least one connection lead. The interconnect further includes a second segment generally in parallel to the vertical plane and connected to the integrated circuit die.

REFERENCES:
patent: 5057907 (1991-10-01), Ooi et al.
patent: 5229916 (1993-07-01), Frankeny et al.
patent: 5517754 (1996-05-01), Beilstein, Jr. et al.
patent: 5530623 (1996-06-01), Sanwo et al.
patent: 5604377 (1997-02-01), Palagonia
patent: 5760471 (1998-06-01), Fujisawa et al.
patent: 5828125 (1998-10-01), Burns

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