Process of producing substantially void-free polyimide composite

Details Process of producing substantially void-free polyimide composite Process of producing substantially void-free polyimide composite

1992-05-15

1994-04-05

Withers, James D.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 87, 156285, 1563071, B29C 6500, B32B 3100, B32B 3126

Patent

active

053001761

ABSTRACT:
Presence of small amounts of certain strongly basic amines in polymerization mixture during composite formation results in void reduction.

REFERENCES:
patent: 3565549 (1971-02-01), Lubowitz et al.
patent: 3697308 (1971-10-01), Lubowitz et al.
patent: 4471022 (1984-09-01), McGregor et al.
patent: 4601945 (1986-07-01), Pike
patent: 4837299 (1989-06-01), Peters et al.
patent: 4898754 (1990-02-01), Christensen et al.

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