Patent
1986-05-05
1988-06-14
Edlow, Martin H.
357 74, 357 80, 357 81, H01L 2302, H01L 2316, H01L 3902, H01L 2302
Patent
active
047515643
ABSTRACT:
A multiple wafer scale assembly apparatus includes first and second wafer scale assemblies connected to termination pins in such a fashion that the completed assembly is operatively self contained.
REFERENCES:
patent: 4082394 (1978-04-01), Gedney et al.
patent: 4578697 (1986-03-01), Takemae
Edlow Martin H.
ITT Corporation
Josephs David R.
Twomey Thomas N.
Walsh Robert A.
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