Pressure equalizer for an integrated circuit chip interconnected

Details Pressure equalizer for an integrated circuit chip interconnected Pressure equalizer for an integrated circuit chip interconnected

1994-05-31

1995-07-11

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361709, 361770, 361749, 439 71, H05K 712

Patent

active

054326796

ABSTRACT:
An integrated circuit chip module assembly (10) is disclosed that electrically interconnects the bond pads of the various integrated circuit chips (20) in the module to circuitry (42) on a thin film multilayer membrane (22). The module assembly includes a heat sink (16) with the back surfaces of the chips (20) in thermal engagement therewith. Contacts (40) of the bond pads of the chips (20) are in electrical engagement with the circuitry (42) on the membrane (22) and are accurately positioned by means of nests (28) formed on the surface of the membrane (22). A contact pressure equalizer (12) engages only selected areas (98) of the membrane (22) opposite the contacts (40) of the chips (20) to urge the contact surfaces (44) on the membrane (22) into electrical engagement with raised contacts (40). The contact pressure equalizer (12) includes a relatively large pressure plate (70) having a layer (74) of relatively soft rubber thereon. A plurality of rigid plates (78) are positioned on the soft rubber layer (74) so that each plate is opposite a respective chip (20). A narrow strip (88) of relatively hard rubber is positioned on each of the rigid plates (78) so that the hard rubber strips engage only the selected areas (98) of the membrane (22). The heat sink (16) and the pressure plate (70) are then bolted together with the chips (20), the hard rubber strips (88), the rigid plates (78), and the soft rubber layer (74) sandwiched in between.

REFERENCES:
patent: 4169642 (1979-10-01), Mouissie
patent: 4658331 (1987-04-01), Berg
patent: 5162613 (1992-11-01), Schoenthaler
patent: 5273440 (1993-12-01), Ashman et al.
patent: 5298686 (1994-04-01), Bourdelaise et al.

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