Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent
1997-07-30
1999-12-21
Guay, John
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
257786, H01L 2349
Patent
active
060052937
ABSTRACT:
The present invention provides a wire-bonding structure of a semiconductor device comprising short and long bonding-wires. The short bonding-wires are provided for electrical connections between outer-positioned electrode bonding pads of the semiconductor device and inner-positioned inner lead bonding pads of longer inner leads. The long bonding-wires are provided for electrical connections between inner-positioned electrode bonding pads of the semiconductor device and outer-positioned inner lead bonding pads of shorter inner leads so that the short bonding-wires and the long bonding-wires area alternately aligned. The short bonding-wires rise to a first top level from the outer-positioned electrode bonding pads and slope down gradually from the first top level onto the inner-positioned inner lead bonding pads. The long bonding-wires rise to a second top level higher than the first level from the inner-positioned electrode bonding pads and slope down gradually from the second top level onto the outer-positioned inner lead bonding pads, whereby the long bonding-wires are kept in higher level than and differ in three-dimensional position from the short bonding-wires.
REFERENCES:
patent: 4618879 (1986-10-01), Mizukaihi et al.
patent: 5168368 (1992-12-01), Gow, 3rd et al.
patent: 5296744 (1994-03-01), Liang et al.
patent: 5359227 (1994-10-01), Liang et al.
patent: 5497031 (1996-03-01), Kozone
patent: 5606196 (1997-02-01), Lee et al.
patent: 5723906 (1998-03-01), Rush
patent: 5734559 (1998-03-01), Banerjee et al.
patent: 5757082 (1998-05-01), Shibata
Guay John
NEC Corporation
LandOfFree
Wire-bonded semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wire-bonded semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire-bonded semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-507819