Fuse-incorporated, chip-type solid electrolytic capacitor

Details Fuse-incorporated, chip-type solid electrolytic capacitor Fuse-incorporated, chip-type solid electrolytic capacitor

1992-02-03

1992-12-01

Griffin, Donald A.

Electricity: electrical systems and devices

Electrolytic systems or devices

Solid electrolytic capacitor

29 2503, H01G 700, H01G 900

Patent

active

051684349

ABSTRACT:
A fuse-incorporated, chip-type solid electrolytic capacitor comprises an element which is composed of an anode body and a dielectric oxide film, a semiconductor layer and a cathode layer sequentially formed on the body. The body is made of a valve metal and carries an anode lead implanted therein. The capacitor also has an insulating resin layer applied to the outer peripheral surface of the element, said outer peripheral surface including an anode-lead-implanted surface and another surface located on the side opposite to the implanted surface, an anode terminal formed on the resin layer applied on the implanted surface, a cathode terminal formed on the resin layer applied on the opposite surface, and a fuse electrically connecting the cathode layer and the cathode terminal. The capacitor can be fabricated by connecting one end of the fuse to a part of the cathode layer, applying the resin layer onto the entire outer peripheral surface of the element except for the anode lead and the connected fuse, forming the anode and cathode terminals on the resin layer, and finally, electrically connecting the opposite end of the fuse to the cathode terminal.

REFERENCES:
patent: 3828227 (1974-08-01), Millard et al.
patent: 3855505 (1974-12-01), Karlik et al.
patent: 4288842 (1981-09-01), Voyles

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