Pulse electrodepositing method

Details Pulse electrodepositing method Pulse electrodepositing method

1978-12-27

1985-01-29

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 451, 204 49, 204 52R, 204DIG9, C25D 518

Patent

active

044964366

ABSTRACT:
Electrodeposition is carried out using an electric current which is applied in the form of pulses between a workpiece and an electrode in an electrolyte from which metal is to be deposited upon the workpiece. The pulses have a pulse duration not greater than 100 microseconds and the pulse duration is preferably between 1-50 microseconds while the off time or interval between adjacent pulses is more than twice as long as the on time of the pulses.

REFERENCES:
patent: 2726202 (1955-12-01), Rockafellow
patent: 3959088 (1976-05-01), Sullivan
patent: 4049507 (1977-09-01), Tokumoto et al.
V. A. Lamb, Plating, vol. 56, No. 8, pp. 909-913, (1969).
A. Kenneth Graham, "Electroplating Engineering Handbook", pp. 573-574, (1955).
W. A. Wesley et al., Reprint from 36th Annual Proc., Am. Electroplaters Soc., pp. 79-91, (1949).
C. C. Wan et al., Plating, pp. 559-564, Jun. 1974.
Heinz W. Dettner et al., "Handbuch der Galvano-Technik", vol. 1, Part 1, p. 135, (1963).
W. Sullivan, Plating, vol. 62, No. 2, pp. 139-141, (1975).

Affiliated with

Also associated with

Rating

Pulse electrodepositing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pulse electrodepositing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pulse electrodepositing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-505281