Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

1994-07-18

1995-07-11

Fourson, George

Fishing, trapping, and vermin destroying

437 77, 437203, 437229, 437912, 437944, H01L 2128, H01L 21335

Patent

active

054321255

ABSTRACT:
In a method of manufacturing a semiconductor apparatus, a resist is coated on a semiconductor substrate and baked. The resist is exposed with an electron beam, and an invertedly tapered opening is formed. Recess etching is performed on the semiconductor substrate through the opening. An electrode is formed at a location determined by the recess etching.

REFERENCES:
patent: 5122387 (1992-06-01), Takenaka et al.
patent: 5190892 (1993-03-01), Sano
Wolf, S and R. Tauber "Silicon Processing for the VLSI ERA", Lattice Press, Sunset Beach, Calif., 1986, p. 518.

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