Device self-alignment by propagation of a reference structure's

Fishing – trapping – and vermin destroying

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437 44, 437101, H01L 21336, H01L 2128

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active

053407580

ABSTRACT:
A self-aligned, inverted, thin film field effect transistor is produced by patterning the gate electrode to have tapered edges followed by conformal deposition of subsequent layers of the device structure up through a support layer followed by deposition of a subordinate layer such as the source/drain metallization) on the support layer. The subordinate layer itself may be a planarization or non-conformal layer or may have a subsequent non-conformal planarization layer disposed thereon. Thereafter, the structure is non-selectively etched (preferably reactive ion etched) until the support layer is exposed by the creation of an aperture in the subordinate layer in alignment with raised portions of the reference layer while leaving the subordinate layer present on other parts of the structure. Thereafter, the remainder of the device is fabricated with the source and drain electrodes self-aligned with respect to the gate conductor using a selective etch method.

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Norbert Marschall, "thin-Film Silicon Transistors for Driving Liquid-Crystal Displays," Technische Rundschau 50/86, pp. 76-81.
Kim et al., "Amorphous Silicon Thin-Film Transistors With Two-Layer Gate Insulator," Appl. Phys. Lett. 54(21), May 1989, pp. 2079-2081.
T. Kodama et al., "A self-Alignment Process for Amorphous Silicon Thin Films Transistors", IEEE Electron Device Letters, vol. EDL-3, Jul. 1982, pp. 187-189.

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