Measuring and testing – Fluid pressure gauge – Diaphragm
Patent
1982-09-28
1985-01-29
Woodiel, Donald O.
Measuring and testing
Fluid pressure gauge
Diaphragm
357 26, 361283, H01G 700, H01L 2984
Patent
active
044958200
ABSTRACT:
A capacitive pressure sensor and its manufacturing method are disclosed. An amplifier is formed on the main surface of a first semiconductor substrate by a diffusion process, and its surface is covered with an insulating film. An electrode is vapor-deposited on the surface of the amplifier and electrically connected to the amplifier through a through hole formed in the insulating film. For forming a diaphragm, the surface of a second semiconductor substrate disposed facing the electrode to form a capacitor, which is opposite to the surface of the second semiconductor substrate facing the electrode, is partially etched away to form a depression. The first and second semiconductor substrates are anodically bonded to each other using a glass layer.
REFERENCES:
patent: 3880009 (1975-04-01), Johnston
patent: 4064550 (1977-12-01), Dias
patent: 4277814 (1981-07-01), Giachino
patent: 4381788 (1983-05-01), Douglas
patent: 4389895 (1983-06-01), Rud
patent: 4405970 (1983-09-01), Swindal
patent: 4426673 (1984-01-01), Bell
patent: 4432007 (1984-02-01), Cady
A Monolithic Capacitive Pressure Sensor with Pulse-Period Output, Craig S. Sander et al., IEEE, vol. ED27, No. 5, May 1980, pp. 927-930.
Miniature Capacitive Pressure Transducer for Biomedical Application, Y. D. Hong et al., Conference CECON 80, Cleveland, 5/20-22/80.
Nishihara Motohisa
Shimada Satoshi
Suzuki Seikou
Yamada Kazuji
Hitachi , Ltd.
Kovalick Vincent P.
Woodiel Donald O.
LandOfFree
Capacitive pressure sensor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Capacitive pressure sensor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Capacitive pressure sensor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-500557