Method of manufacturing multilayer circuit substrate

Details Method of manufacturing multilayer circuit substrate Method of manufacturing multilayer circuit substrate

1995-07-19

1998-05-05

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156253, 1562728, 29846, 427 96, 427123, 427125, B32B 3118, B32B 3126, H05K 302, B05D 512

Patent

active

057468680

ABSTRACT:
A method of manufacturing a multilayer circuit substrate includes a process of forming via holes in an insulating film, a process of applying an electrically conducting paste obtained by having ultra-fine metal particles disperse in a solvent onto an insulating film, and a process of forming vias composed of a sintered product of ultra-fine metal particles in the via holes by removing the solvent and also sintering the ultra-fine metal particles. The sintered products of the ultra-fine metal particles on the insulating layer is removed (or patterned) by peeling off the protective film stuck to the insulating layer.

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