Metal fusion bonding – Process – Plural joints
Patent
1991-05-16
1992-12-01
Seidel, Richard K.
Metal fusion bonding
Process
Plural joints
228254, 2281733, B23K 3102
Patent
active
051673614
ABSTRACT:
A method of forming flat solder bumps (16 and 18) on contact areas (12 and 14) of a first side and second side of a printed circuit board (12, 14 and 10) comprises the steps of applying solder paste in a predetermined pattern and a predetermined thickness on the contact areas of the first side and the second side of the printed circuit board forming joint areas. Next, the solder paste is reflowed. Then, the solder joints on the first side are flattened (17). Before surface mounted components (20 and 26) are mounted on the printed circuit board, tack media (32) is dispensed onto the joint areas. Subsequently, the printed circuit boards is reflowed. Now the second side of the printed circuit board is flattened (19). As with the first side, tack media (34) is dispensed on the solder joints on the second side before surface mounted components (40 and 46) are mounted on the second side. Finally, the printed circuit board is reflowed again.
REFERENCES:
patent: 4752027 (1988-06-01), Gschwend
patent: 4889275 (1989-12-01), Mullen et al.
IBM Technical Disclosure Bulletin, vol. 32, No. 1, Jun. 1989, pp. 50-51.
de Costa Alves Francisco
Liebman Henry F.
Suppelsa Anthony B.
Knapp Jeffrey T.
Meles Pablo
Motorola Inc.
Seidel Richard K.
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