Thermosetting resin composition useful for forming insulating la

Details Thermosetting resin composition useful for forming insulating la Thermosetting resin composition useful for forming insulating la

1989-08-24

1991-03-05

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523440, 523443, 523466, C08K 700, C08K 336, C08K 334

Patent

active

049978632

ABSTRACT:
A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed circuit board is disclosed which includes an aromatic epoxy resin having at least two epoxy groups, an aromatic polyamine mica having an average particle size of 50 .mu.m or less, and silica having an average particle size of 20 .mu.m or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80% based on the total weight of the silica and the mica.

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