Air-blow solder ball loading system for micro ball grid arrays

Details Air-blow solder ball loading system for micro ball grid arrays Air-blow solder ball loading system for micro ball grid arrays

1997-07-14

1999-12-21

Ryan, Patrick

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Solid flux or solid filler

228 33, 228246, 221200, 221211, B23K 100, B23K 3512, B65H 360, B23Q 704

Patent

active

060037539

ABSTRACT:
In a ball grid array (BGA) station (50) having a robotic arm (60) with a vacuum head (70) containing a predetermined quantity of vacuum apertures (90), a method and apparatus of loading an array of solder balls (14) for solder bumping a carrier (20). Solder balls (14) are supplied into a tub (500) having a head opening (510) for accommodating a vacuum head (70). After the vacuum head (70) is positioned by the robotic arm (60) towards the head opening (510) of the tub (500), suitable fluid pressure (570) is applied to the solder balls (14) within the tub (500) to force the solder balls (14) to float on the gas pressure towards the vacuum apertures (90). The vacuum apertures (90), which are appropriately sized and annularly shaped has at least a partial vacuum (34) applied through the apertures (90) to suck-up a desired quantity of solder balls for eventual placement on the BGA carrier (20).

REFERENCES:
patent: 5279045 (1994-01-01), Odashima et al.
patent: 5445313 (1995-08-01), Boyd et al.
patent: 5467913 (1995-11-01), Namekawa et al.
patent: 5601229 (1997-02-01), Nakazato et al.

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