Plastic and nonmetallic article shaping or treating: processes – Vacuum treatment of work – To degas or prevent gas entrapment
Patent
1989-10-10
1991-03-05
Silbaugh, Jan H.
Plastic and nonmetallic article shaping or treating: processes
Vacuum treatment of work
To degas or prevent gas entrapment
264DIG78, B29C 3104
Patent
active
049976060
ABSTRACT:
Thermal transfer between a semiconductor wafer and a platen during vacuum processing is provided through a soft, thermally-conductive polymer layer having a thin, hard surface film. The soft polymer layer, which is preferably silicon rubber containing thermally-conductive particles, conforms to surface irregularities on the wafer and has low thermal resistance. The surface film is preferably silicon dioxide in the form of a multiplicity of flat plates integrally formed on the silicone rubber. Adherence of the wafer and of foreign matter to the polymer layer is prevented by the surface film. In addition, the underlying polymer layer is protected by the surface film. A high purity polymer layer is fabricated by evacuating the mold cavity and the resin container prior to injection of resin. The mold for the polymer layer utilizes a hard, smooth mold release surface and a resilient gasket between the platen and the mold release surface. The gasket establishes the dimensions of the polymer layer and seals the mold cavity. The surface film is formed by oxygen plasma treatment of the silicone rubber layer.
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G. M. Greenstein et al. "Heat Sinking Wafer Gripper", IBM Tech. Disclosure Bull. vol. 20, No. 3, 8/77.
Mears Eric L.
Pierce Keith D.
Cole Stanley Z.
Fiorilla Christopher A.
Sgarbossa Peter J.
Silbaugh Jan H.
Varian Associates Inc.
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