Chemistry: electrical and wave energy – Processes and products
Patent
1989-09-20
1991-03-05
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
204 24, 204281, C25D 108
Patent
active
049975285
ABSTRACT:
The mold for producing a perforated body to be used as a friction spinning element comprises a mold body provided with throughpass holes extending between the opposite mold body surfaces. Each of the throughpass holes is filled with a non-conducting material. Thus, there can be simultaneously formed by electroforming at the opposite mold body surfaces two perforated bodies which may be of the same or different thickness. By virtue of the simultaneous fabrication of the two perforated bodies the openings or perforations thereof are exactly in alignment or coincident and, if desired, these two perforated bodies can be secured to one another in superposed orientation to form a composite friction spinning element, such as a friction spinning plate or disc or an endless friction spinning belt or band.
REFERENCES:
patent: 3046202 (1962-07-01), Horner
patent: 3616278 (1971-10-01), Jansen
Article in Publication Entitled "Metalloberflache", 19th Publication Year, vol. 12, Dec. 1965, pp. 369 to 372, Munich, West Germany.
Article of H. J. Heinrich Entitled "Galvanoplastische Siebherstellung"; ARticle in 20th Publication Year, vol. 8, Aug. 1966, pp. 333 to 336. J.
Article of H. J. Heinrich, Entitled "Verfahren zur Beeinflussung der Lochprofile bei der Galvanoplastischen Siebherstellung".
Maschinenfabrik Rieter AG
Tufariello T. M.
LandOfFree
Mold for, and method of, fabricating a perforated body and perfo does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Mold for, and method of, fabricating a perforated body and perfo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold for, and method of, fabricating a perforated body and perfo will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-494603