Apparatus for producing semiconductor devices

Details Apparatus for producing semiconductor devices Apparatus for producing semiconductor devices

1990-06-01

1991-03-05

Woo, Jay H.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

26427217, 425121, 4251261, 425543, B29C 4502, H01L 2156

Patent

active

049973550

ABSTRACT:
An apparatus for producing semiconductor devices includes a resin molding section for resin-molding semiconductor chips, a loading section for supplying a lead frame, to which the semiconductor chips are bonded, to the resin molding section, a tablet supplying device which supplies a resin tablet to the resin molding section, an unloading section which takes out the resin-molded semiconductor chips with the lead frame from the resin molding section, and a dust cover which covers the resin molding section, the tablet supplying device and the unloading section.

REFERENCES:
patent: 3793714 (1974-02-01), Bylander
patent: 4173821 (1979-11-01), Yamamoto et al.
patent: 4323415 (1982-04-01), Meyer
patent: 4534921 (1985-08-01), Fierkens et al.
patent: 4748050 (1988-05-01), Takahashi et al.
patent: 4812114 (1989-03-01), Kennon et al.

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