Plated bridge step-over connection for monolithic devices and me

Details Plated bridge step-over connection for monolithic devices and me Plated bridge step-over connection for monolithic devices and me

1981-05-15

1984-03-13

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

204 15, 204192R, 427 79, 427 80, 430314, 430315, H01L 2188

Patent

active

044367660

ABSTRACT:
A step-over connection in a monolithic device including laterally spaced alizations having upper surfaces at one or more levels above a supporting substrate and a dielectric layer over one of the metalizations. The connection is in the form of a metal bridge spanning the space between the metalizations, and is formed by successive steps of providing a first resist layer, forming openings therein, etching away an area of dielectric layer, gold plating pillars on the exposed metalization surfaces, sputtering a gold film on the first resist layer and exposed pillars, providing a second resist layer with a pillar connecting bridge pattern opening, gold plating the bridge connection on the exposed sputtered gold film, and removing the resist layers and excess gold film.

REFERENCES:
patent: 4054484 (1977-10-01), Lesh
patent: 4200975 (1980-05-01), Debiec
patent: 4289846 (1981-09-01), Parks
patent: 4293637 (1981-10-01), Hatada

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