Method for treatment of metal substrate for growth of hydrogen-c

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427 39, 427 86, 136258, B05D 306

Patent

active

044367619

ABSTRACT:
In the deposition of a hydrogen-containing semiconductor film on a metal substrate, the electric contact characteristic between the metal substrate and the semiconductor film is improved by preparatorily exposing to hydrogen plasma the surface of the metal substrate on which the semiconductor film is to be deposited.

REFERENCES:
patent: 4200473 (1980-04-01), Carlson

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for treatment of metal substrate for growth of hydrogen-c does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for treatment of metal substrate for growth of hydrogen-c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for treatment of metal substrate for growth of hydrogen-c will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-491962

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.