Solder shaping process

Details Solder shaping process Solder shaping process

1989-07-20

1991-03-05

Heinrich, Sam

Metal fusion bonding

Process

With shaping

228174, 228203, 228246, B23K 120, B23K 3102, B23K 3300

Patent

active

049971220

ABSTRACT:
A process for treating the surface of solid fusible solder supported on a substrate, comprises a heated tool having a treatment surface with a selected shape. The heated tool is brought into contact with the solder for fusing the solder to reshape the surface of the solder. The tool is allowed to cool to permit the solder to resolidify, and when withdrawn from the solder, leaving the imprinted shape. The treatment surface is made of material which is not wettable by the solder. Stops may be utilized for limiting movement between the tool and the substrate to a specified gap for the treatment surface.

REFERENCES:
patent: 3373481 (1968-03-01), Lins et al.
patent: 3387365 (1968-06-01), Stelmak
patent: 3589000 (1971-06-01), Galli
patent: 3750265 (1973-08-01), Cushman
patent: 4750666 (1988-06-01), Neugebauer et al.
patent: 4752027 (1988-06-01), Gschwend
patent: 4836435 (1989-06-01), Napp et al.
patent: 4857671 (1989-08-01), Nakano et al.
patent: 4872604 (1989-10-01), Zimmer
IBM Technical Disclosure Bulletin, "Serrated, Flattened Pad . . . ", vol. 9, No. 11, p. 1653, Apr. 1967.
Western Electric, ". . . Wire Bonding Tip", Technical Digest, No. 20, p. 7, Oct. 1970.

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