Process for manufacturing boride dispersion copper alloys

Metal treatment – Compositions – Heat treating

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148 611, 204 37R, 204 49, 427431, C23F 700

Patent

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044365594

ABSTRACT:
A process for manufacturing a boride dispersion copper alloy by preparing a metallic material having a surface portion comprising at least one of beryllium, gallium, manganese, nickel, palladium, silicon and vanadium, and copper or an alloy thereof, and diffusing boron into the surface portion. The resulting material includes fine boride particles uniformly dispersed in the surface portion and is useful as a material for electrical contacts or sliding parts due to its high resistance to adhesion, wear and arc, and excellent electrical conductivity and sliding properties.

REFERENCES:
patent: 2196002 (1940-04-01), Whitney et al.
patent: 2955959 (1960-10-01), Du Rose
patent: 3352667 (1967-11-01), Das et al.
patent: 3634145 (1972-01-01), Homan
patent: 4011107 (1977-03-01), Hayes

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