Chemistry: electrical and wave energy – Processes and products
Patent
1988-09-27
1990-06-05
Niebling, John F.
Chemistry: electrical and wave energy
Processes and products
204 20, 204 30, 204 384, 427 97, 427 98, 427307, C25D 556
Patent
active
049311484
ABSTRACT:
Printed circuit boards containing thru-holes requiring metallization are manufactured by first applying to the board material an alkaline strippable resist in a predetermined desired pattern, thereafter applying material catalytic to subsequent metallization, thereafter treating the board with an aqueous alkaline solution to remove catalytic material from resist surfaces without adversely affecting the catalyst at non-resist areas, and then metallizing the non-resist areas. The ability to preliminarily apply the resist pattern before catalyst application, metallization, etc., yet prevent metallization of the resist, enables the manufacturing process to proceed straight through the activation, metallization, etc. steps without need for interruption for resist application.
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F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 421-423.
Kukanskis Peter E.
Rhodenizer Harold
Leader William T.
MacDermid Incorporated
Niebling John F.
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