Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1991-05-17
1993-09-07
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
361688, 361730, 361736, H05K 500
Patent
active
052431312
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The invention is directed to a housing for an electronic circuit provided with a connection plug, particularly for control device electronics of an internal combustion engine of a vehicle, comprising a cooling frame to which a printed circuit board comprising the electronic circuit is fastened and which has at least one cooling portion with which power components connected to the printed circuit board are connected so as to conduct heat, and comprising a cover enclosing the printed circuit board.
Such a housing is known from DE-PS 25 46 334. The housing has comprises a cooling frame which carries a board and chambers for receiving components to be cooled - such as load resistors. The cooling frame is further provided in part with a base on which components of a power stage which generate a relatively high level of heat are located. The base extends parallel to the plane of the printed circuit board, i.e. it lies at a right angle to the side walls of the cooling frame. A receiving clip, through which a connection plug projects, is fastened to the cooling frame so as to be detachable. A hood covers the printed circuit board, the hood being placed over the cooling frame having the printed circuit board and abutting with its edge against a sealing ring which is inserted in a guide groove of the receiving clip. The construction and design of the housing have proven successful, but are quite complicated, since the cooling frame requires a special section; therefore, this is a cost-intensive solution. Moreover, the heat elimination from the heat-generating components is in need of improvement for certain constructions.
SUMMARY OF THE INVENTION
In contrast, the housing, according to the invention has the advantage of a very simple and accordingly economical construction which enables very good dissipation of heat. The cooling frame is constructed, according to the invention, as a flat frame with flat frame legs lying substantially parallel to the plane of the printed circuit board. Such a flat frame is very simple to produce. A stamped sheet metal part is preferably used. Housing cover pieces forming the cover for the printed circuit board are fastened to the upper and lower sides of the flat frame. The flat frame carrying the printed circuit board is accordingly enclosed on both sides by a housing cover piece. These housing cover pieces, which are constructed in an approximately trough-shaped manner, are likewise simple to produce. Since the flat frame communicates with the housing cover pieces over a large surface area, a good dissipation of heat is ensured.
Holding tabs which face toward the frame interior preferably proceed from the flat frame for the purpose of fastening the printed circuit board. In particular, the holding tabs are constructed so as to be bent at right angles in such a way that the printed circuit board rests in a plane parallel to the flat frame legs at a distance from the latter. Accordingly, it is possible to provide sufficient space for a housing seal--to be described in more detail in the following--in spite of the smallest possible surface area.
According to a further development of the invention, at least one cooling portion, which is constructed as a bent cooling bracket, proceeds from at least one of the flat frame legs. The cooling bracket is at an angle, preferably 90.degree., to the plane of the printed circuit board. Accordingly, it is possible to mount components-- particularly power components--generating a relatively high level of heat on the printed circuit board already during the production of the latter. The wherein the connection wires of the power components are soldered ,with the conductor paths of the printed circuit board. A heat-removing connection to the cooling bracket is produced, when mounting the printed circuit board is mounted on the cooling frame. In particular, the housing of the power components comes into contact with the cooling bracket over a large surface area, so that there is relatively low heat transmission resistance
REFERENCES:
patent: 3348148 (1967-10-01), Parsons et al.
patent: 4138711 (1979-02-01), Bremenour et al.
patent: 4409641 (1983-11-01), Jakob et al.
patent: 4471407 (1984-11-01), Sleder
patent: 4811165 (1989-03-01), Currier et al.
patent: 4858071 (1989-08-01), Manabe et al.
Bentz Willy
Hussmann Dieter
Jakob Gert
Karr Dieter
Schiefer Peter
Ledynh Bot
Picard Leo P.
Robert & Bosch GmbH
Striker Michael J.
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