Copper metallizations

Details Copper metallizations Copper metallizations

1976-10-15

1978-01-24

Padgett, Benjamin R.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428901, 252512, 106 113, 106 105, H01B 102

Patent

active

040705188

ABSTRACT:
Copper-based metallizations, useful in the electronics art, comprising copper powder and certain alkali metal/lead borosilicate glass powders. The copper and glass may be dispersed in an inert liquid vehicle, printed on a substrate, and fired in a nitrogen atmosphere to produce conductor patterns. Also the resultant fired conductor patterns.

REFERENCES:
patent: 2993815 (1961-07-01), Treptow
patent: 3484284 (1969-12-01), Dates et al.
patent: 3647532 (1972-03-01), Friedman et al.
patent: 3827891 (1974-08-01), Larry
patent: 3950174 (1976-04-01), Suzuki et al.
patent: 3970465 (1976-07-01), Houben
patent: 3970590 (1976-07-01), Hoffman et al.

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