Plating mechanism

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Patent

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Details

204201, C25D 1716, C25D 1710

Patent

active

040627527

ABSTRACT:
There is provided a plating system comprising a series of plating and/or processing tanks with spiral grooved plating and processing barrels. The spiral groove is located interally of the barrels which are substantially hollow. The spiral groove or channel is arranged to automatically translate the material to be plated through the barrels. In addition, each barrel includes a chute at the end of the spiral groove. The chute is arranged such that the plated material from one barrel is automatically transferred into the adjacent barrel or the like wherein no manual labor is required. Internally of at least one of the barrels is disposed a plating unit comprising a plurality of individual, flexible strips which contact material to be plated thereby determining the polarity of the material and assisting in the plating process.

REFERENCES:
patent: 360852 (1887-04-01), Cassel
patent: 908439 (1909-01-01), Backus
patent: 1342899 (1920-06-01), Eddy
patent: 1557474 (1925-10-01), Farrand
patent: 1912400 (1933-06-01), O'Neill
patent: 2133324 (1938-10-01), Hosdowich
patent: 2856345 (1958-10-01), Pociask
patent: 2975120 (1961-03-01), Kenmore et al.
patent: 3421992 (1969-01-01), Lazaro

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