Hybrid package arrangement

Details Hybrid package arrangement Hybrid package arrangement

1989-05-19

1990-06-05

Lee, John D.

357 74, G02B 642

Patent

active

049308572

ABSTRACT:
A package arrangement is disclosed which utilizes a multi-layer ceramic (MLC) component subassembly member which extends beyond the periphery of the package sidewalls. The MLC member constains a number of bondpad sites formed on its inner layers to provide for the connection of leads to the package, where the leads do not have to penetrate the package sidewalls. This aspect of the package thus provides improved hermeticity over prior art designs. A metallic base plate is attached to the underside of the MLC and is electrically connected to metallic sidewalls to provide EMI and mechanical protection. The package may be utilized for housing either electronic or optoelectronic components.

REFERENCES:
patent: 4527010 (1985-07-01), Anazawa et al.
patent: 4670770 (1987-06-01), Tai
patent: 4752109 (1988-06-01), Gordon et al.
patent: 4772523 (1988-09-01), Mace et al.
patent: 4835593 (1989-05-01), Arnold et al.

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